DYNACHEM VACUUM LAMINATION SYSTEM is specially designed for high-end semiconductor industry, especially for IC substrate and FOPLP (Fan-Out Panel Level Packing)!!
FLATTENING UNIT is one of the major features, providing outstanding surface planarity.
If only laminate photoresist (no flattening unit), PET carrier conveyance is NOT necessary in order to eliminate PET cost and replacement time.
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We offer wide range of processing equipment.
We assist to design and manufacture automatic system upon to customers' need.
- ROBOTIC LOADER / UNLOADER (FOR BROWN OXIDE)Auxiliary equipment are shown but not limited as below:
Inspection / testing equipment are shown but not limited as below:
Indirect materials are shown but not limited as below: