DYNACHEM VACUUM LAMINATION SYSTEM is specially designed for high-end semiconductor industry, especially for IC substrate and FOPLP (Fan-Out Panel Level Packing)!!

FLATTENING UNIT is one of the major features, providing outstanding surface planarity.

If only laminate photoresist (no flattening unit), PET carrier conveyance is NOT necessary in order to eliminate PET cost and replacement time.

READ MORE

We offer wide range of processing equipment.

- HORIZONTAL WET PROCESS LINE

- VACUUM LAMINATOR

- CUT SHEET LAMINATOR

- PRESSING MACHINE

- BONDING MACHINE

- X-RAY TARGET DRILL MACHINE

We assist to design and manufacture automatic system upon to customers' need.

- ROBOTIC LOADER / UNLOADER (FOR BROWN OXIDE)

- DRILL PROCESS SETUP SYSTEM

- CUSTOMIZED (Please contact our sales team for details.)

Auxiliary equipment are shown but not limited as below:

- COVER SHEET REMOVER

- MESHING CLEANING

- PRE-HEATER

- CLEANING UNIT

- DRILL BIT RE-SHARPENING MACHINE

- OPEN / SHORT REPAIRING EQUIPMENT

Inspection / testing equipment are shown but not limited as below:

- AVI (AUTOMATIC VISUAL INSPECTION)

- MICROVIA INSPECTION MACHINE

- PATTERN WIDTH / SPACING MEASUREMENT MACHINE

- PANEL THICKNESS MEASUREMENT MACHINE

- COPPER THICKNESS MEASUREMENT MACHINE

- DRILL BIT INSPECTION MACHINE

- MASK INSPECTION MACHINE

Indirect materials are shown but not limited as below:

- PRESS PAD (PAPER TYPE)

- CONFORMABLE RELEASE FILM

- RELEASE FILM (NON-SILICONE)

- LAMINATION SEPARATOR

- RELEASING AGENT FOR LAMINATION

- CLEANING MATERIALS FOR CLEAN ROOM