Vacuum Laminator
Brand Information
Brand Name: DynaChem
Manufacturer: Automatic Lamination Technologies
Origin: Italy
Featuers
- Employs vacuum, heat and high pressure to achieve perfect lamination with excellent encapsulation and no air trapped.
- Applies two-step lamination - dynamic and static slap down, to ensure excellent adhesion.
- Both in-line (with pre-tack) and stand-alone (only vacuum lamination) mode are available.
Applications
The applications cover the industry of IC substrate, wafer, embedded component, packaging, rigid-flex / flex PCB and LED.
Model Characteristics
Depends on various applications and product types, we recommend different models to suit your need:
| Model | Major Applications |
Major Products |
Operation Mode |
Configuration |
Flattening Module |
| AVL-S2 | Pattern DF, 2nd DF | IC Substrate | Automatic | Pre-tack + Vacuum Laminator, Silicon Belt Conveyance | Optional* |
| MVP24 |
DFSR, ABF | IC Substrate, FOPLP, Wafer, Embedded Component | Automatic | Pre-tack + Vacuum Laminator + Flattening Unit, PET Conveyance | Standard |
| 7224-HP7 | Pattern DF, 2nd DF, ABF, Phosphor Film | IC Substrate, Wafer, LED Substrate, Embedded Component | Manual | Stand-alone Vacuum Laminator | N/A |
* For AVL-S2, if choose to add flattening unit, the conveyance system must switch to PET carrier.